Junior-D Connectors (.030″ Contact Pitch)
PA&E’s family of Junior-D hermetic connectors are compatible with lightweight materials such as aluminum and titanium, as well as conventional iron/nickel alloys. They are designed for use in military, space, and commercial applications where environmental conditions require an extremely rugged and reliable hermetic seal. The DC connectors feature unique controlled CTE characteristics, chemical bonding properties and polycrystalline structure of Kryoflex,® allow PA&E to manufacture this part with a 304L stainless steel shell and gold-plated beryllium-copper contacts for excellent electrical performance and environmental characteristics. These DC connectors can be produced for both laser-welded and solder-in applications.
PA&E’s hermetically-sealed Junior-D connectors are a miniature version of our mil-spec Sub-D hermetic connectors and provide a space savings of 70% over a standard Sub-D.
Junior-D DC Connectors Specifications and Testing Configuration
|Low-Profile Flanged||Low-Profile Not Flanged||Standard Profile Flanged||Standard Profile Double End|
|Specifications||Material Compatibility||Designed for Aluminum, Titanium or Iron/Nickel Alloy applications|
|Contact Material||Beryllium Copper CDA Alloy 172/173|
|Shell Finish Options||Passivated, Nickel/Gold Plated or Chromate Conversion Coated as applicable|
|Contact Finish||Nickel/Gold Plating|
|No. of Contacts||9, 15, 21, 25, 31, 37|
|Opt. Solder Cup||Contact PA&E|
|Performance||Lead Rate||Less than 1×10-9cc/sec Helium at 1 atmospheric differential pressure|
|Insulation Resistance||Connectors provide greater than 5,000 Megohms at 500 VDC when tested in IAW MIL-STD-1344, Method 3003|
|Dielectric Withstanding Voltage||Connectors exhibit no evidence of breakdown or flashover when tested in IAW MIL-STD-1344, Method 3003|
|Corrosion Resistance||Connectors meet salt spray test in IAW MIL-STD-1344, Method 3003|
|Operating Temperature||-65°C to 200°C|