Hermetic Electronic Packaging

Hermetic Integrated Electronic Packaging

PA&E specializes in the design, precision machining and connector integration for ultra-rugged, light-weight hermetic integrated electronic packaging for use in extreme environments.

Precision Machining of Hermetic Integrated Electronic Packaging

Using technologies such as Kryoflex® polycrystalline ceramic and explosively bonded metals, PA&E designs and manufactures hermetic electronic packaging for extreme environments. Whether it’s integrating hermetic components that protect satellites deep in space or producing hermetic connectors for oil-drilling tools that bore deep below the earth’s surface, electronic packaging from PA&E are designed to deliver high levels of reliability under the harshest conditions.

By pairing Kryoflex and explosively bonded metal technologies;
utilizing precision machining techniques to build hermetic electronic packaging and using precision laser welding rather than solder joints, electronic packages from PA&E won’t be impacted by the two most common causes of hermetic package failure: solder joint fatigue and cracked glass.integrated_titaniumhousing4-lg

PA&E produces titanium composite packaging for markets such as the military, aerospace industries and also creates medical implantable packaging using materials with a proven history of implantable viability.